JPH0558665B2 - - Google Patents
Info
- Publication number
- JPH0558665B2 JPH0558665B2 JP62059358A JP5935887A JPH0558665B2 JP H0558665 B2 JPH0558665 B2 JP H0558665B2 JP 62059358 A JP62059358 A JP 62059358A JP 5935887 A JP5935887 A JP 5935887A JP H0558665 B2 JPH0558665 B2 JP H0558665B2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- chip carrier
- lead
- hybrid integrated
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62059358A JPS63226053A (ja) | 1987-03-13 | 1987-03-13 | 混成集積チツプモジユ−ル |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62059358A JPS63226053A (ja) | 1987-03-13 | 1987-03-13 | 混成集積チツプモジユ−ル |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63226053A JPS63226053A (ja) | 1988-09-20 |
JPH0558665B2 true JPH0558665B2 (en]) | 1993-08-27 |
Family
ID=13110962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62059358A Granted JPS63226053A (ja) | 1987-03-13 | 1987-03-13 | 混成集積チツプモジユ−ル |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63226053A (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001102486A (ja) * | 1999-07-28 | 2001-04-13 | Seiko Epson Corp | 半導体装置用基板、半導体チップ搭載基板、半導体装置及びその製造方法、回路基板並びに電子機器 |
-
1987
- 1987-03-13 JP JP62059358A patent/JPS63226053A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63226053A (ja) | 1988-09-20 |
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